Invention Grant
US08489237B2 High throughput method of in transit wafer position correction in a system using multiple robots
有权
在使用多个机器人的系统中，通过晶圆位置校正的高通量方法
- Patent Title: High throughput method of in transit wafer position correction in a system using multiple robots
- Patent Title (中): 在使用多个机器人的系统中，通过晶圆位置校正的高通量方法
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Application No.: US13243906Application Date: 2011-09-23
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Publication No.: US08489237B2Publication Date: 2013-07-16
- Inventor: Chris Gage , Damon Genetti
- Applicant: Chris Gage , Damon Genetti
- Applicant Address: US CA Fremont
- Assignee: Novellus Systems, Inc.
- Current Assignee: Novellus Systems, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: G05B19/418
- IPC: G05B19/418
Abstract:
Methods correcting wafer position error are provided. The methods involve measuring wafer position error on a robot during transfer to an intermediate station. This measurement data is then used by a second robot to perform wafer pick moves from the intermediate station with corrections to center the wafer. Wafer position correction may be performed at only one location during the transfer process. Also provided are systems and apparatuses for transferring wafers using an intermediate station.
Public/Granted literature
- US20120014773A1 HIGH THROUGHPUT METHOD OF IN TRANSIT WAFER POSITION CORRECTION IN A SYSTEM USING MULTIPLE ROBOTS Public/Granted day:2012-01-19
Information query
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