Invention Grant
- Patent Title: Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
- Patent Title (中): 用于在处理室中支撑,定位和旋转衬底的装置和方法
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Application No.: US13294709Application Date: 2011-11-11
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Publication No.: US08490660B2Publication Date: 2013-07-23
- Inventor: Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
- Applicant: Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: B65B31/04
- IPC: B65B31/04

Abstract:
An apparatus and method for supporting, positioning and rotating a substrate are provided. In one embodiment, a support assembly for supporting a substrate includes an upper base plate and a lower base plate. The substrate is floated on a thin layer of air over the upper base plate. A positioning assembly includes a plurality of air bearing edge rollers or air flow pockets used to position the substrate in a desired orientation inside above the upper base plate. A plurality of slanted apertures or air flow pockets are configured in the upper base plate for flowing gas therethrough to rotate the substrate to ensure uniform heating during processing.
Public/Granted literature
- US20120055405A1 APPARATUS AND METHOD FOR SUPPORTING, POSITIONING AND ROTATING A SUBSTRATE IN A PROCESSING CHAMBER Public/Granted day:2012-03-08
Information query
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