Invention Grant
US08491093B2 Liquid ejecting head unit, liquid ejecting apparatus, and method of producing liquid ejecting apparatus
有权
液体喷射头单元,液体喷射装置和液体喷射装置的制造方法
- Patent Title: Liquid ejecting head unit, liquid ejecting apparatus, and method of producing liquid ejecting apparatus
- Patent Title (中): 液体喷射头单元,液体喷射装置和液体喷射装置的制造方法
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Application No.: US13315261Application Date: 2011-12-08
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Publication No.: US08491093B2Publication Date: 2013-07-23
- Inventor: Hiroyuki Hagiwara , Masayuki Eguchi , Kimiyasu Otsuki , Masanori Mochizuki
- Applicant: Hiroyuki Hagiwara , Masayuki Eguchi , Kimiyasu Otsuki , Masanori Mochizuki
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2010-275451 20101210
- Main IPC: B41J2/15
- IPC: B41J2/15

Abstract:
A liquid ejecting head unit includes a liquid ejecting head having a nozzle forming surface provided with nozzle rows consisting of several rows of nozzles for ejecting liquid; and a head fixing member to which the liquid ejecting head is fixed with an intermediate member therebetween. The liquid ejecting head has an intermediate-member fixing portion to which the intermediate member is fixed. The intermediate member has a head-fixing-member bonding surface to be securely bonded to an intermediate-member bonding surface of the head fixing member with adhesive. The head-fixing-member bonding surface has a chamfered portion along at least a portion of an outer edge thereof, the chamfered portion being provided such that the distance from the intermediate-member bonding surface gradually increases from the inner side toward the outer side of the head-fixing-member bonding surface.
Public/Granted literature
- US20120147093A1 LIQUID EJECTING HEAD UNIT, LIQUID EJECTING APPARATUS, AND METHOD OF PRODUCING LIQUID EJECTING APPARATUS Public/Granted day:2012-06-14
Information query
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