Invention Grant
- Patent Title: Chemical-mechanical polishing formulation and methods of use
- Patent Title (中): 化学机械抛光配方及使用方法
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Application No.: US12685938Application Date: 2010-01-12
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Publication No.: US08491806B2Publication Date: 2013-07-23
- Inventor: James A. Hagan , James Hannah
- Applicant: James A. Hagan , James Hannah
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Katherine S. Brown, Esq.
- Main IPC: H01L21/302
- IPC: H01L21/302
Abstract:
The invention is directed to a chemical-mechanical polishing formulation that includes: an abrasive particulate component; iodic acid; and water. The invention is also directed to a method for polishing a metal-containing substrate, the method including the steps of polishing the metal-containing substrate with a polishing pad at a suitable polishing pressure while the metal-containing substrate is in contact with the above polishing formulation.
Public/Granted literature
- US20110171832A1 Chemical-Mechanical Polishing Formulation and Methods of Use Public/Granted day:2011-07-14
Information query
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