Invention Grant
- Patent Title: Laminate type ceramic electronic component and method for manufacturing same
- Patent Title (中): 层叠型陶瓷电子部件及其制造方法
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Application No.: US13181572Application Date: 2011-07-13
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Publication No.: US08491834B2Publication Date: 2013-07-23
- Inventor: Yuichi Iida , Yusuke Otsuka
- Applicant: Yuichi Iida , Yusuke Otsuka
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2009-009516 20090120
- Main IPC: C04B33/32
- IPC: C04B33/32

Abstract:
A laminate type ceramic electronic component includes a thick film resistor and an overcoat layer so as to prevent defects such as delamination from being caused and to prevent the thick film resistor from being cracked after laser trimming, even when a method is adopted in which an unfired composite laminate is subjected to firing in such a way that an unfired ceramic laminate, an unfired thick film resistor, and an unfired overcoat layer are each integrally sintered. The unfired overcoat layer includes a glass ceramic material containing a ceramic and glass having substantially the same constituents and compositional ratio as those of the glass contained in the unfired ceramic layer. The respective glass ceramic materials constituting the unfired ceramic layer and the unfired overcoat layer are adjusted so that the ratio of a crystalline phase with a smaller coefficient of thermal expansion than the coefficient of thermal expansion of the fired ceramic layer is higher in the overcoat layer than in the ceramic layer.
Public/Granted literature
- US20110266036A1 LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME Public/Granted day:2011-11-03
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