Invention Grant
- Patent Title: Heat sinking element and method of treating a heat sinking element
- Patent Title (中): 散热元件和散热元件的处理方法
-
Application No.: US12981525Application Date: 2010-12-30
-
Publication No.: US08492003B2Publication Date: 2013-07-23
- Inventor: Cheng-Chuan Wang , Chia-Ying Yen , Hsin-Hwa Chen
- Applicant: Cheng-Chuan Wang , Chia-Ying Yen , Hsin-Hwa Chen
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW99140576A 20101124
- Main IPC: B32B15/20
- IPC: B32B15/20 ; F28F21/08 ; H05K7/20 ; C25D11/18
Abstract:
A heat sinking element and a method of treating a heat sinking element are provided. The heat sinking element includes a metal substrate. The metal substrate is mainly composed of aluminium. A surface of the metal substrate has a plurality of micro-nano holes and a diameter of the micro-nano holes is smaller than 300 nm. The method of treating a heat sinking element includes performing an oxidation process and an etching process on the metal substrate so as to form the plurality of micro-nano holes.
Public/Granted literature
- US20120125577A1 HEAT SINKING ELEMENT AND METHOD OF TREATING A HEAT SINKING ELEMENT Public/Granted day:2012-05-24
Information query
