A method is provided for assembling a stack of surface-mount devices (SMDs) on a substrate. The method provides a substrate, die, or printed circuit board (PCB) with a top surface having a landing pad and a first reference feature. An alignment jig is placed overlying the substrate top surface. The alignment jig second reference feature is aligned with respect to the substrate first reference feature. A first SMD is placed overlying the substrate landing pad. The first SMD third reference feature is aligned with respect to the alignment jig second reference feature. A second SMD is placed overlying the substrate top surface. Then, the alignment jig first boundary feature is mated with the second SMD second boundary feature. In response to the mating, the second SMD first interface is aligned over an underlying SMD active element.