Invention Grant
US08492469B2 Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device including the cured film
失效
正型感光性树脂组合物，固化膜，保护膜，绝缘膜和半导体装置以及包括固化膜的显示装置
- Patent Title: Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device including the cured film
- Patent Title (中): 正型感光性树脂组合物，固化膜，保护膜，绝缘膜和半导体装置以及包括固化膜的显示装置
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Application No.: US12991125Application Date: 2009-04-28
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Publication No.: US08492469B2Publication Date: 2013-07-23
- Inventor: Hiromichi Sugiyama , Yasunori Takahashi
- Applicant: Hiromichi Sugiyama , Yasunori Takahashi
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2008-120846 20080507
- International Application: PCT/JP2009/058728 WO 20090428
- International Announcement: WO2009/136647 WO 20091112
- Main IPC: C08K13/02
- IPC: C08K13/02
Abstract:
A positive-type photosensitive resin composition includes (A) an alkali-soluble resin, (B) a photosensitizer, and (C) a silicon compound shown by the following general formula (1). (R2O)3—Si—R1—Si—(OR2)3 (1) wherein R1 represents an alkylene group having 5 to 30 carbon atoms or an organic group that includes at least one aromatic ring, and R2 represents an alkyl group having 1 to 10 carbon atoms. The positive-type photosensitive resin composition exhibits excellent storage stability, produces a film that exhibits excellent adhesion to a substrate during development, and produces a cured film that exhibits excellent adhesion to a substrate after humidification.
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