Invention Grant
- Patent Title: Semiconductor device and semiconductor device manufacturing method
- Patent Title (中): 半导体器件和半导体器件制造方法
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Application No.: US13243254Application Date: 2011-09-23
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Publication No.: US08492813B2Publication Date: 2013-07-23
- Inventor: Hiroki Shinkawata
- Applicant: Hiroki Shinkawata
- Applicant Address: JP Kawasaki-shi
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2003-044155 20030221; JP2003-345633 20031003
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
A semiconductor device including a semiconductor substrate having a logic formation region where a logic device is formed; a first impurity region formed in an upper surface of the semiconductor substrate in the logic formation region; a second impurity region formed in an upper surface of the semiconductor substrate in the logic formation region; a third impurity region formed in an upper surface of the first impurity region and having a conductivity type different from that of the second impurity region; a fourth region formed in an upper surface of the second impurity region and having a conductivity type different from that of the second impurity region; a first silicide film formed in an upper surface of the third impurity region; a second silicide film formed in an upper surface of the fourth impurity region and having a larger thickness than the first silicide film.
Public/Granted literature
- US20120012936A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD Public/Granted day:2012-01-19
Information query
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