Invention Grant
- Patent Title: Power semiconductor device
- Patent Title (中): 功率半导体器件
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Application No.: US13500659Application Date: 2009-10-14
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Publication No.: US08492836B2Publication Date: 2013-07-23
- Inventor: Naruhisa Miura , Shuhei Nakata , Kenichi Ohtsuka , Shoyu Watanabe , Shiro Hino , Akihiko Furukawa
- Applicant: Naruhisa Miura , Shuhei Nakata , Kenichi Ohtsuka , Shoyu Watanabe , Shiro Hino , Akihiko Furukawa
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2009/005356 WO 20091014
- International Announcement: WO2011/045834 WO 20110421
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
In a semiconductor device according to the present invention, a p-type well region disposed in an outer peripheral portion of the power semiconductor device is divided into two parts, that is, an inside and an outside, and a field oxide film having a greater film thickness than the gate insulating film is provided on a well region at the outside to an inside of an inner periphery of the well region. Therefore, it is possible to prevent, in the gate insulating film, a dielectric breakdown due to the voltage generated by the flow of the displacement current in switching.
Public/Granted literature
- US20120205669A1 POWER SEMICONDUCTOR DEVICE Public/Granted day:2012-08-16
Information query
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