Invention Grant
- Patent Title: Lateral hyperabrupt junction varactor diode in an SOI substrate
- Patent Title (中): SOI衬底中的横向超破坏结变容二极管
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Application No.: US13449419Application Date: 2012-04-18
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Publication No.: US08492843B2Publication Date: 2013-07-23
- Inventor: Jeffrey B. Johnson , Alvin J. Joseph , Robert M. Rassel , Yun Shi
- Applicant: Jeffrey B. Johnson , Alvin J. Joseph , Robert M. Rassel , Yun Shi
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Anthony J. Canale
- Main IPC: H01L29/786
- IPC: H01L29/786

Abstract:
A varactor diode includes a portion of a top semiconductor layer of a semiconductor-on-insulator (SOI) substrate and a gate electrode located thereupon. A first electrode having a doping of a first conductivity type laterally abuts a doped semiconductor region having the first conductivity type, which laterally abuts a second electrode having a doping of a second conductivity type, which is the opposite of the first conductivity type. A hyperabrupt junction is formed between the second doped semiconductor region and the second electrode. The gate electrode controls the depletion of the first and second doped semiconductor regions, thereby varying the capacitance of the varactor diode. A design structure for the varactor diode is also provided.
Public/Granted literature
- US20120199907A1 LATERAL HYPERABRUPT JUNCTION VARACTOR DIODE IN AN SOI SUBSTRATE Public/Granted day:2012-08-09
Information query
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