Invention Grant
- Patent Title: Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof
- Patent Title (中): 绝缘构件，金属基底基板和半导体模块及其制造方法
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Application No.: US13162239Application Date: 2011-06-16
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Publication No.: US08492909B2Publication Date: 2013-07-23
- Inventor: Kenji Okamoto , Tatsuya Ganbe
- Applicant: Kenji Okamoto , Tatsuya Ganbe
- Applicant Address: JP
- Assignee: Fuji Electric Co., Ltd.
- Current Assignee: Fuji Electric Co., Ltd.
- Current Assignee Address: JP
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2010-138136 20100617
- Main IPC: H01L23/29
- IPC: H01L23/29
Abstract:
An insulating member of the invention can include an epoxy resin, a first inorganic filler diffused in the epoxy resin and having an average particle diameter of 1 to 99 nm, and a second inorganic filler diffused in the epoxy resin and having an average particle diameter of 0.1 to 100 μm. The first and second inorganic fillers can be independent of each other, and can be selected from a group including Al2O3, SiO2, BN, AlN, and Si3N4, and the blending ratios of the first and second inorganic fillers in the insulating member can be 0.1 to 7% by weight and 80 to 95% by weight respectively. A metal base substrate can be formed by forming a metal foil and a metal base on either surface of the insulating member.
Public/Granted literature
- US20110309527A1 INSULATING MEMBER, METAL BASE SUBSTRATE, AND SEMICONDUCTOR MODULE, AND MANUFACTURING METHODS THEREOF Public/Granted day:2011-12-22
Information query
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