Invention Grant
- Patent Title: Stacked interconnect heat sink
- Patent Title (中): 堆叠互连散热器
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Application No.: US12840016Application Date: 2010-07-20
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Publication No.: US08492911B2Publication Date: 2013-07-23
- Inventor: Mark A. Bachman , John W. Osenbach , Sailesh M. Merchant
- Applicant: Mark A. Bachman , John W. Osenbach , Sailesh M. Merchant
- Applicant Address: US CA Milpitas
- Assignee: LSI Corporation
- Current Assignee: LSI Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Hitt Gaines PC
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
An electronic device includes an integrated circuit and a heat spreader. The integrated circuit includes a substrate with an active via located therein. The heat spreader includes a thermally conductive core. The active via is connected to a corresponding heat spreader via that passes through the thermally conductive core.
Public/Granted literature
- US20120020028A1 STACKED INTERCONNECT HEAT SINK Public/Granted day:2012-01-26
Information query
IPC分类:
