A magnetodielectric substrate includes a first dielectric layer, a second dielectric layer, conductive patterns, and a plurality of air vias. The first dielectric layer has a predetermined height, and the second dielectric layer is stacked on the first dielectric layer. Conductive patterns are coated on an upper surface and a lower surface of one of the first and second dielectric layers. A plurality of air vias is formed with a predetermined diameter and a predetermined interval such that they pass through up to the conductive patterns of the upper and lower surfaces from the dielectric layer on which the conductive patterns are coated.