Invention Grant
US08493423B2 Thermal recording head and thermal recording apparatus comprising the same 有权
包含该记录头和热记录装置的热记录头和热记录装置

  • Patent Title: Thermal recording head and thermal recording apparatus comprising the same
  • Patent Title (中): 包含该记录头和热记录装置的热记录头和热记录装置
  • Application No.: US13146621
    Application Date: 2010-01-27
  • Publication No.: US08493423B2
    Publication Date: 2013-07-23
  • Inventor: Takashi AsoMakoto Miyamoto
  • Applicant: Takashi AsoMakoto Miyamoto
  • Applicant Address: JP Kyoto
  • Assignee: Kyocera Corporation
  • Current Assignee: Kyocera Corporation
  • Current Assignee Address: JP Kyoto
  • Agency: DLA Piper LLP (US)
  • Priority: JP2009-016526 20090128
  • International Application: PCT/JP2010/051009 WO 20100127
  • International Announcement: WO2010/087355 WO 20100805
  • Main IPC: B41J2/335
  • IPC: B41J2/335
Thermal recording head and thermal recording apparatus comprising the same
Abstract:
[Problem] There are provided a thermal recording head capable of making proper operation of a converter, and a thermal recording apparatus including the same.[Solution] A thermal recording head (10) of the invention is driven on a basis of a first control signal and includes a head substrate (20) including heat generating elements (23a), a wiring substrate (30) including, on its surface, a wiring pattern (312) for transmission of the first control signal, and a mount substrate (40) disposed facing a back surface of the head substrate (20) and a back surface of the wiring substrate (30) and configured to mount the head substrate (20) and the wiring substrate (30). On the surface of the head substrate (20) is placed a control element (27) electrically connected to the heat generating elements (23a) and configured to control driving of the heat generating elements (23a). On the surface of the wiring substrate (30) is placed a converter (323) electrically connected to the wiring pattern (312) and configured to convert the first control signal into a second control signal. The mount substrate (41) is spaced away from a corresponding region at the back surface of the wiring substrate (30) that corresponds to a fourth placement area (40d) bearing the converter (323) on the surface of the wiring substrate (30).
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