An imaging apparatus includes a photoelectric conversion element package, a chassis member arranged at a position opposite a rear surface of the photoelectric conversion element package, a wiring member electrically connected to the photoelectric conversion element package. The wiring member has an opening that exposes the rear surface of the photoelectric conversion element package. The wiring member is arranged between the rear surface of the photoelectric conversion element package and the chassis member. The imaging apparatus further includes a heat conduction member configured to contact the rear surface of the photoelectric conversion element package, exposed by the opening, and the chassis member.