Invention Grant
- Patent Title: Head wrap procedure
- Patent Title (中): 头包装程序
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Application No.: US13115903Application Date: 2011-05-25
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Publication No.: US08493682B2Publication Date: 2013-07-23
- Inventor: Nhan X. Bui , Ernest S. Gale , Reed A. Hancock , Kazuhiro Tsuruta
- Applicant: Nhan X. Bui , Ernest S. Gale , Reed A. Hancock , Kazuhiro Tsuruta
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Zilka-Kotab, PC
- Main IPC: G09B15/078
- IPC: G09B15/078

Abstract:
According to one embodiment, a method includes tracking a magnetic tape moving in a first direction using at least one reader of an inner module of a head having at least the inner module and first and second outer modules positioned on opposite sides of the inner module and aligned with the inner module in a tape travel direction, detecting a signal using at least one reader of the first outer module as the tape passes thereacross, moving a guide positioned in front of the first outer module in a direction towards the tape until the signal detected by the first outer module decreases by a predetermined amount, and moving the guide directionally away from the tape to a position to set about a predetermined wrap angle of the tape relative to the first outer module after the signal detected by the first outer module decreases by the predetermined amount.
Public/Granted literature
- US20120300337A1 HEAD WRAP PROCEDURE Public/Granted day:2012-11-29
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