Invention Grant
- Patent Title: Liquid cooling arrangement for electronic apparatus
- Patent Title (中): 电子设备的液体冷却装置
-
Application No.: US12910194Application Date: 2010-10-22
-
Publication No.: US08493735B2Publication Date: 2013-07-23
- Inventor: Takashi Iijima
- Applicant: Takashi Iijima
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2009-258578 20091112
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An electronic apparatus includes, an apparatus casing detachably connected to another electronic apparatus, a heat receiver having a flow passage of a cooling medium and assembled in the apparatus casing, and an cooling-medium input and output unit connecting the flow passage of the heat receiver to a circulatory pathway of the cooling medium, the circulatory pathway including a heat exchange taking heat from the cooling medium outside the apparatus casing.
Public/Granted literature
- US20110110043A1 ELECTRONIC APPARATUS Public/Granted day:2011-05-12
Information query