Invention Grant
US08493745B2 Low-profile motherboard with side-mounted memory modules using a dual-opening edge connector
有权
带有双开口边缘连接器的侧面安装内存模块的低调主板
- Patent Title: Low-profile motherboard with side-mounted memory modules using a dual-opening edge connector
- Patent Title (中): 带有双开口边缘连接器的侧面安装内存模块的低调主板
-
Application No.: US13269526Application Date: 2011-10-07
-
Publication No.: US08493745B2Publication Date: 2013-07-23
- Inventor: Ramon S. Co
- Applicant: Ramon S. Co
- Applicant Address: US CA Fountain Valley
- Assignee: Kingston Technology Corp.
- Current Assignee: Kingston Technology Corp.
- Current Assignee Address: US CA Fountain Valley
- Agency: gPatent LLC
- Agent Stuart T. Auvinen
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
A low-profile personal computer (PC) motherboard has memory modules mounted to an edge of the motherboard rather than mounted perpendicular using standard memory module sockets. The PC motherboard has a lower profile since memory module sockets are removed from the top surface of the PC motherboard. Expansion card sockets are also removed by integrating expansion functions into chips on the PC motherboard, or using an edge-mounted connector to the expansion card or to an external peripheral. Motherboard metal contacts are formed on an extended plug region near the edge of the PC motherboard. A first opening or slot of an edge connector fits over the motherboard metal contacts, while a second opening or slot of the edge connector fits over metal contacts on a standard memory module. The memory module and the PC motherboard each have printed-circuit boards (PCBs) that are in the same plane, thus reducing the overall height.
Public/Granted literature
- US20130088829A1 Low-Profile Motherboard with Side-Mounted Memory Modules Using a Dual-Opening Edge Connector Public/Granted day:2013-04-11
Information query