Invention Grant
- Patent Title: Packaging system with hollow package and method for the same
- Patent Title (中): 包装系统采用中空包装和方法相同
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Application No.: US11769520Application Date: 2007-06-27
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Publication No.: US08493748B2Publication Date: 2013-07-23
- Inventor: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Lionel Chien Hui Tay , Jeffrey D. Punzalan
- Applicant: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Lionel Chien Hui Tay , Jeffrey D. Punzalan
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent I-Chang John Yang
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H05K7/18
Abstract:
A packaging system comprising: forming terminal leads; configuring a cavity by partially encapsulating the terminal leads with a compound; attaching an integrated circuit device, a micro-electromechanical system, a micro-mechanical system, or a combination thereof in the cavity; and bonding a cover to the terminal leads for enclosing the cavity.
Public/Granted literature
- US20090002961A1 PACKAGING SYSTEM WITH HOLLOW PACKAGE Public/Granted day:2009-01-01
Information query
