Invention Grant
- Patent Title: Speaker and speaker enclosure
- Patent Title (中): 扬声器和扬声器外壳
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Application No.: US11742308Application Date: 2007-04-30
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Publication No.: US08494203B2Publication Date: 2013-07-23
- Inventor: Jeffrey Rodman , Wayne Stanley Foletta
- Applicant: Jeffrey Rodman , Wayne Stanley Foletta
- Applicant Address: US CA San Jose
- Assignee: Polycom, Inc.
- Current Assignee: Polycom, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Wong, Cabello, Lutsch, Rutherford & Brucculeri, L.L.P.
- Main IPC: H04R1/02
- IPC: H04R1/02

Abstract:
Systems, methods, and devices for providing high quality speaker performance in a small-scale design are disclosed. In accordance with various embodiments of the present invention, a small-scale speaker assembly is provided which is capable of delivering high-fidelity wideband audio. The speaker assembly includes a speaker driver and a number of electronic components within an enclosure. In some embodiments at least one microphone is included in the assembly. In some embodiments the speaker assembly is well suited for audio conferencing. In some embodiments low-frequency performance is improved in a small-scale design.
Public/Granted literature
- US20070280498A1 SPEAKER AND SPEAKER ENCLOSURE Public/Granted day:2007-12-06
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