Invention Grant
- Patent Title: Heat pump module and drying apparatus using the same
- Patent Title (中): 热泵模块和干燥装置使用它
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Application No.: US12700190Application Date: 2010-02-04
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Publication No.: US08495822B2Publication Date: 2013-07-30
- Inventor: Na Eun Kim , Cheol Soo Ko , Young Min Kim
- Applicant: Na Eun Kim , Cheol Soo Ko , Young Min Kim
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates LLP
- Priority: KR10-2009-0009374 20090205
- Main IPC: F26B21/06
- IPC: F26B21/06 ; F26B11/02 ; F25B13/00 ; F25D21/00

Abstract:
A heat pump module and a drying apparatus having the same are provided. The heat pump module may include a housing, an evaporator provided in the housing that condenses humid air introduced into the housing via evaporation of a refrigerant, a condenser provided in the housing that heats the air having passed through the evaporator via condensation of the refrigerant, and at least one condensed water guide or remover provided in the housing that removes condensed water generated on a surface of the evaporator therefrom.
Public/Granted literature
- US20100192397A1 HEAT PUMP MODULE AND DRYING APPARATUS USING THE SAME Public/Granted day:2010-08-05
Information query
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