Invention Grant
- Patent Title: Heat sinks with distributed and integrated jet cooling
- Patent Title (中): 散热器采用分布式和集成式喷射冷却
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Application No.: US12421068Application Date: 2009-04-09
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Publication No.: US08496049B2Publication Date: 2013-07-30
- Inventor: Mehmet Arik , Tunc Icoz , Juan Manuel Rivas Davila , Charles Erklin Seeley , Yogen Vishwas Utturkar , Stanton Earl Weaver, Jr.
- Applicant: Mehmet Arik , Tunc Icoz , Juan Manuel Rivas Davila , Charles Erklin Seeley , Yogen Vishwas Utturkar , Stanton Earl Weaver, Jr.
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Penny A. Clarke
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.
Public/Granted literature
- US20100258270A1 HEAT SINKS WITH DISTRIBUTED AND INTEGRATED JET COOLING Public/Granted day:2010-10-14
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