Invention Grant
- Patent Title: Pump assembly
- Patent Title (中): 泵总成
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Application No.: US12879236Application Date: 2010-09-10
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Publication No.: US08496303B2Publication Date: 2013-07-30
- Inventor: Masaki Misunou , Chiharu Nakazawa
- Applicant: Masaki Misunou , Chiharu Nakazawa
- Applicant Address: JP Ibaraki
- Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee Address: JP Ibaraki
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2009-215912 20090917
- Main IPC: B60T8/40
- IPC: B60T8/40 ; F01C1/08

Abstract:
A pump assembly including a housing, a pump unit having a low pressure portion and a high pressure portion and accommodated in a pump unit receiving portion which is formed in the housing, a suction passage, a low pressure chamber communicated with the suction passage and the low pressure portion, and a discharge passage, wherein when the pump unit is accommodated in the pump unit receiving portion, the low pressure chamber is formed between the pump unit and a wall surface of the housing which defines the pump unit receiving portion, and the discharge passage is formed by a communication pipe which extends through the low pressure chamber and communicates the housing and the high pressure portion of the pump unit with each other.
Public/Granted literature
- US20110062773A1 PUMP ASSEMBLY Public/Granted day:2011-03-17
Information query
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