Invention Grant
- Patent Title: Metalized printhead substrate overmolded with plastic
- Patent Title (中): 金属化打印头基材用塑料包覆成型
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Application No.: US12538921Application Date: 2009-08-11
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Publication No.: US08496317B2Publication Date: 2013-07-30
- Inventor: Mario J. Ciminelli , Eric A. Merz , Dwight J. Petruchik
- Applicant: Mario J. Ciminelli , Eric A. Merz , Dwight J. Petruchik
- Applicant Address: US NY Rochester
- Assignee: Eastman Kodak Company
- Current Assignee: Eastman Kodak Company
- Current Assignee Address: US NY Rochester
- Agent William R. Zimmerli
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16
Abstract:
A liquid ejector includes an electrically insulating support having a first surface and a second surface. An electrical trace begins on the first surface of the support and ends on the second surface of the support. An ejector die is positioned on the first surface of the support and electrically connected to the portion of the electrical trace located on the first surface of the support. A polymer material is molded on a portion of the ejector die and at least a portion of the first surface of the support. A portion of the electrical trace remains free of the polymer material.
Public/Granted literature
- US20110037808A1 METALIZED PRINTHEAD SUBSTRATE OVERMOLDED WITH PLASTIC Public/Granted day:2011-02-17
Information query
IPC分类:
