Invention Grant
- Patent Title: Wiring board contributable to reduction in thickness of light emitting apparatus and having high versatility
- Patent Title (中): 布线板有助于减少发光装置的厚度并具有高通用性
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Application No.: US12658502Application Date: 2010-02-11
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Publication No.: US08496350B2Publication Date: 2013-07-30
- Inventor: Takeharu Naito , Kazuaki Ibaraki , Nobukazu Kato
- Applicant: Takeharu Naito , Kazuaki Ibaraki , Nobukazu Kato
- Applicant Address: JP Tokyo
- Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee Address: JP Tokyo
- Agency: Collard & Roe, P.C.
- Priority: JP2009-053677 20090306
- Main IPC: F21S4/00
- IPC: F21S4/00 ; F21V21/00
Abstract:
The wiring board comprises an FFC and a through-hole portion as a segmenting portion. The through-hole portion segments the conductive pattern of the FFC into a plurality of conductive pattern segments. The conductive pattern segments connect the light emitting elements to thereby connect the light emitting elements in series to one another.
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