Invention Grant
US08496512B2 Polishing pad, polishing method and method of forming polishing pad
有权
抛光垫，抛光方法和抛光垫的成型方法
- Patent Title: Polishing pad, polishing method and method of forming polishing pad
- Patent Title (中): 抛光垫，抛光方法和抛光垫的成型方法
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Application No.: US13648971Application Date: 2012-10-10
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Publication No.: US08496512B2Publication Date: 2013-07-30
- Inventor: Yu-Piao Wang
- Applicant: IV Technologies Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: IV Technologies Co., Ltd.
- Current Assignee: IV Technologies Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Ditthavong Mori & Steiner P.C.
- Main IPC: B24B1/00
- IPC: B24B1/00
Abstract:
A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.
Public/Granted literature
- US20130040539A1 POLISHING PAD, POLISHING METHOD AND METHOD OF FORMING POLISHING PAD Public/Granted day:2013-02-14
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