Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
- Patent Title (中): 基板加工装置及基板处理方法
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Application No.: US12754872Application Date: 2010-04-06
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Publication No.: US08496761B2Publication Date: 2013-07-30
- Inventor: Koji Kaneyama , Akihiro Hisai , Toru Asano , Hiroshi Kobayashi , Tsuyoshi Okumura , Shuichi Yasuda , Masashi Kanaoka , Tadashi Miyagi , Kazuhito Shigemori
- Applicant: Koji Kaneyama , Akihiro Hisai , Toru Asano , Hiroshi Kobayashi , Tsuyoshi Okumura , Shuichi Yasuda , Masashi Kanaoka , Tadashi Miyagi , Kazuhito Shigemori
- Applicant Address: JP Kyoto
- Assignee: Sokudo Co., Ltd.
- Current Assignee: Sokudo Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2004-326309 20041110; JP2005-095784 20050329; JP2005-216159 20050726
- Main IPC: B08B3/00
- IPC: B08B3/00 ; H01L21/31 ; G03F7/00 ; G03F1/00

Abstract:
A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to an interface block. The interface block comprises a drying processing group including two drying processing units and an interface transport mechanism. After a substrate is subjected to exposure processing by the exposure device, the substrate is transported to the drying processing units in the drying processing group by the interface transport mechanism, where the substrate is subjected to cleaning and drying processings.
Public/Granted literature
- US20100190116A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2010-07-29
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