Invention Grant
- Patent Title: Rotary magnet sputtering apparatus
- Patent Title (中): 旋转磁体溅射装置
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Application No.: US12593660Application Date: 2008-03-28
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Publication No.: US08496792B2Publication Date: 2013-07-30
- Inventor: Tadahiro Ohmi , Tetsuya Goto , Takaaki Matsuoka
- Applicant: Tadahiro Ohmi , Tetsuya Goto , Takaaki Matsuoka
- Applicant Address: JP Sendai-Shi JP Tokyo
- Assignee: National University Corporation Tohoku University,Tokyo Electron Limited
- Current Assignee: National University Corporation Tohoku University,Tokyo Electron Limited
- Current Assignee Address: JP Sendai-Shi JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2007-092058 20070330
- International Application: PCT/JP2008/056139 WO 20080328
- International Announcement: WO2008/123434 WO 20081016
- Main IPC: C23C14/35
- IPC: C23C14/35

Abstract:
In a rotary magnet sputtering apparatus, a target consumption displacement quantity is measured, and corresponding to the measurement results, a distance between a rotating magnet group and a target is adjusted, and uniform film forming rate is achieved over a long period of time so as to reduce the change of a target surface due to consumption of the target and to reduce the change of the film forming rate with time. An ultrasonic sensor or a laser transmitting/receiving device may be used as a means for measuring the consumption displacement quantity of the target.
Public/Granted literature
- US20100126852A1 ROTARY MAGNET SPUTTERING APPARATUS Public/Granted day:2010-05-27
Information query
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