Invention Grant
- Patent Title: Chip resistor substrate
- Patent Title (中): 芯片电阻基板
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Application No.: US12596887Application Date: 2008-04-17
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Publication No.: US08496866B2Publication Date: 2013-07-30
- Inventor: Claus Peter Kluge
- Applicant: Claus Peter Kluge
- Applicant Address: DE Plochingen
- Assignee: CeramTec GmbH
- Current Assignee: CeramTec GmbH
- Current Assignee Address: DE Plochingen
- Agency: Fulbright & Jaworski LLP
- Priority: DE102007019875 20070425
- International Application: PCT/EP2008/054638 WO 20080417
- International Announcement: WO2008/132055 WO 20081106
- Main IPC: B29C71/00
- IPC: B29C71/00
Abstract:
A method for the targeted introduction of cleavage lines or predetermined breaking lines in ceramic substrates for subsequent separation, wherein, in a thermal treatment step or methods step, the cleavage line or predetermined breaking line is heated locally and then cooled suddenly by a coolant in such a way that targeted cracking or material weakness occurs along the cleavage line or predetermined breaking lines.
Public/Granted literature
- US20100221478A1 CHIP RESISTOR SUBSTRATE Public/Granted day:2010-09-02
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