Invention Grant
- Patent Title: Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component
- Patent Title (中): 用于电子部件的引线框带和模具装置以及封装电子部件的方法
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Application No.: US13612922Application Date: 2012-09-13
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Publication No.: US08497158B2Publication Date: 2013-07-30
- Inventor: Jeffrey Khai Huat Low , Kean Cheong Lee
- Applicant: Jeffrey Khai Huat Low , Kean Cheong Lee
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L21/56
- IPC: H01L21/56
Abstract:
A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages.
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Information query
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