Invention Grant
- Patent Title: Method for providing an LED chip with a peripheral protective film before cutting the same from a wafer
-
Application No.: US12383447Application Date: 2009-03-24
-
Publication No.: US08497161B2Publication Date: 2013-07-30
- Inventor: Chiu Chung Yang
- Applicant: Chiu Chung Yang
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method is disclosed to divide a wafer into chips. In the method, a substrate is provided. The substrate is made of an isolating material. An epitaxial laminate is provided on the substrate. At least one slit is made through the epitaxial laminate completely to form at least two chips connected to each other by the substrate only so that each of the chips includes a portion of the substrate and a portion of the epitaxial laminate. Positive and negative electrodes are formed in each of the chips. An upper protective film is provided to cover an upper side of each of the chips except the electrodes. A peripheral protective film is provided into the slit to cover the periphery of the portion of the epitaxial laminate of each of the chips. Finally, the chips are separated from each other.
Public/Granted literature
- US20090186448A1 Method for providing an LED chip with a peripheral protective film before cutting the same from a wafer Public/Granted day:2009-07-23
Information query
IPC分类:
