Invention Grant
US08497176B2 Semiconductor device with STI and method for manufacturing the semiconductor device
有权
具有STI的半导体器件和用于制造半导体器件的方法
- Patent Title: Semiconductor device with STI and method for manufacturing the semiconductor device
- Patent Title (中): 具有STI的半导体器件和用于制造半导体器件的方法
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Application No.: US13164297Application Date: 2011-06-20
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Publication No.: US08497176B2Publication Date: 2013-07-30
- Inventor: Taiji Ema , Kazuhiro Mizutani
- Applicant: Taiji Ema , Kazuhiro Mizutani
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor device includes: a semiconductor substrate having first and second areas; an STI isolation region being made of an isolation trench formed in the semiconductor substrate and an insulating film burying the isolation trench and defining a plurality of active regions in the first and second areas; a first structure formed on an area from the active region in the first area to a nearby STI isolation region and having a first height; and a second structure formed on an area from the active region in the second area to a nearby STI isolation region and having a second height, wherein the surface of the said STI isolation region in the first area is lower than the surface of said STI isolation region in the second area.
Public/Granted literature
- US20110244650A1 SEMICONDUCTOR DEVICE WITH STI AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE Public/Granted day:2011-10-06
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