Invention Grant
- Patent Title: Semiconductor device and method for making the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13454398Application Date: 2012-04-24
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Publication No.: US08497178B2Publication Date: 2013-07-30
- Inventor: Masashi Shima
- Applicant: Masashi Shima
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
In a MOS-type semiconductor device in which, on a Si substrate, a SiGe layer having a valence band edge energy value smaller than a valence band edge energy value of the first semiconductor layer and a mobility larger than a mobility of the first semiconductor layer, a Si cap layer, and an insulating layer are sequentially laminated, the problem of the shift of the absolute value of the threshold voltage toward a smaller value caused by negative fixed charges formed in or near the interface between the Si cap layer and the insulting film by diffusion of Ge is overcome by neutralizing the negative fixed charges by positive charges induced in and near the interface between the Si cap layer and the insulating film along with addition of nitrogen atoms to the semiconductor device surface by NO gas annealing and thereby shifting the threshold voltage toward a larger value.
Public/Granted literature
- US20120208354A1 SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME Public/Granted day:2012-08-16
Information query
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