Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13716177Application Date: 2012-12-16
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Publication No.: US08497181B1Publication Date: 2013-07-30
- Inventor: Wensheng Wang
- Applicant: Fujitsu Semiconductor Limited
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Fujitsu Patent Center
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
An FeRAM is produced by a method including the steps of forming a lower electrode layer, forming a first ferroelectric film on the lower electrode layer, forming on the first ferroelectric film a second ferroelectric film in an amorphous state containing iridium inside, thermally treating the second ferroelectric film in an oxidizing atmosphere to crystallize the second ferroelectric film and to cause iridium in the second ferroelectric film to diffuse into the first ferroelectric film, forming an upper electrode layer on the second ferroelectric film, and processing each of the upper electrode layer, the second ferroelectric film, the first ferroelectric film, and the lower electrode layer to form the capacitor structure. With such a structure, the inversion charge amount in a ferroelectric capacitor structure is improved without increasing the leak current pointlessly, and a high yield can be assured, thereby realizing a highly reliable FeRAM.
Public/Granted literature
- US20130178038A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-07-11
Information query
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