Invention Grant
- Patent Title: Selective epitaxial growth method using halogen containing gate sidewall mask
- Patent Title (中): 选择性外延生长法使用含卤素的侧壁面罩
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Application No.: US12285723Application Date: 2008-10-14
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Publication No.: US08497191B2Publication Date: 2013-07-30
- Inventor: Masahiro Fukuda , Yosuke Shimamune , Masaaki Koizuka , Katsuaki Ookoshi
- Applicant: Masahiro Fukuda , Yosuke Shimamune , Masaaki Koizuka , Katsuaki Ookoshi
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2007-051106 20060227; JP2006-229917 20060825
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/31

Abstract:
A semiconductor device in which selectivity in epitaxial growth is improved. There is provided a semiconductor device comprising a gate electrode formed over an Si substrate, which is a semiconductor substrate, with a gate insulating film therebetween and an insulating layer formed over sides of the gate electrode and containing a halogen element. With this semiconductor device, a silicon nitride film which contains the halogen element is formed over the sides of the gate electrode when an SiGe layer is formed over the Si substrate. Therefore, the SiGe layer epitaxial-grows over the Si substrate with high selectivity. As a result, an OFF-state leakage current which flows between, for example, the gate electrode and source/drain regions is suppressed and a manufacturing process suitable for actual mass production is established.
Public/Granted literature
- US20090117715A1 Semiconductor device fabricated by selective epitaxial growth method Public/Granted day:2009-05-07
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