Invention Grant
- Patent Title: Method for radiation hardening a semiconductor device
- Patent Title (中): 辐射硬化半导体器件的方法
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Application No.: US13346319Application Date: 2012-01-09
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Publication No.: US08497195B2Publication Date: 2013-07-30
- Inventor: Wesley H. Morris
- Applicant: Wesley H. Morris
- Applicant Address: US TX Austin
- Assignee: Silicon Space Technology Corporation
- Current Assignee: Silicon Space Technology Corporation
- Current Assignee Address: US TX Austin
- Agency: Howison & Arnott, L.L.P.
- Main IPC: H01L21/425
- IPC: H01L21/425

Abstract:
Semiconductor devices can be fabricated using conventional designs and process but including specialized structures to reduce or eliminate detrimental effects caused by various forms of radiation. Such semiconductor devices can include the one or more parasitic isolation devices and/or buried guard ring structures disclosed in the present application. The introduction of design and/or process steps to accommodate these novel structures is compatible with conventional CMOS fabrication processes, and can therefore be accomplished at relatively low cost and with relative simplicity.
Public/Granted literature
- US20120108045A1 METHOD FOR RADIATION HARDENING A SEMICONDUCTOR DEVICE Public/Granted day:2012-05-03
Information query
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