Invention Grant
US08497451B2 Brittle nonmetallic workpiece and method and device for making same
有权
脆性非金属工件及其制造方法及装置
- Patent Title: Brittle nonmetallic workpiece and method and device for making same
- Patent Title (中): 脆性非金属工件及其制造方法及装置
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Application No.: US12141091Application Date: 2008-06-18
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Publication No.: US08497451B2Publication Date: 2013-07-30
- Inventor: Mu-Chi Hsu , Qing Liu , Guo-Han Yue , Chi-Lu Chih , Jun-Qi Li
- Applicant: Mu-Chi Hsu , Qing Liu , Guo-Han Yue , Chi-Lu Chih , Jun-Qi Li
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200710203368 20071224
- Main IPC: B23K26/00
- IPC: B23K26/00 ; C03B33/02 ; C03B33/09

Abstract:
An exemplary brittle non-metallic workpiece (70) is made by the laser beam (31), a cutting surface (701 ) of the brittle non-metallic workpiece has no micro cracks. A method for making the brittle non-metallic workpiece includes: focusing a laser beam on the brittle non-metallic substrate to form an elliptic beam spot; driving the laser beam to move along a predetermined curved cutting path, making a center of a major axis of the elliptic beam spot intersecting along the predetermined curved cutting path and the major axis being tangent to the predetermined curved cutting path at the intersecting point; a coolant stream following the elliptic beam spot to move, thus producing a crack in the brittle non-metallic substrate corresponding to the predetermined curved cutting path; separating the brittle non-metallic substrate along the crack. A laser cutting device (40) for making the same is also provided.
Public/Granted literature
- US20090159580A1 BRITTLE NONMETALLIC WORKPIECE AND METHOD AND DEVICE FOR MAKING SAME Public/Granted day:2009-06-25
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