Invention Grant
US08497468B2 Encoder having an overmolded cover, encoder system with an encoder having an overmolded cover, and method for manufacturing an encoder having an overmolded cover
有权
具有包覆成型盖的编码器，具有包覆成型盖的编码器的编码器系统以及用于制造具有包覆成型盖的编码器的方法
- Patent Title: Encoder having an overmolded cover, encoder system with an encoder having an overmolded cover, and method for manufacturing an encoder having an overmolded cover
- Patent Title (中): 具有包覆成型盖的编码器，具有包覆成型盖的编码器的编码器系统以及用于制造具有包覆成型盖的编码器的方法
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Application No.: US11961864Application Date: 2007-12-20
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Publication No.: US08497468B2Publication Date: 2013-07-30
- Inventor: Robert M. Setbacken , Gary Rhodes , Esteban Cortina , Tony Cepeda
- Applicant: Robert M. Setbacken , Gary Rhodes , Esteban Cortina , Tony Cepeda
- Applicant Address: US IL Schaumburg
- Assignee: Heidenhain Corporation
- Current Assignee: Heidenhain Corporation
- Current Assignee Address: US IL Schaumburg
- Agency: Kenyon & Kenyon LLP
- Main IPC: G01D5/34
- IPC: G01D5/34
Abstract:
An encoder includes a rotor including: a shaft and a code disk attached to the shaft; a stator including a scanning unit configured to generate an electrical signal corresponding to an angular position of the code disk; a cable configured to transfer the electrical signal; and a cover overmolded onto the stator, where the scanning unit is sealed from an outer environment by the cover.
Public/Granted literature
Information query
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