Invention Grant
- Patent Title: Capacitor and method of forming same
- Patent Title (中): 电容器及其形成方法
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Application No.: US13221419Application Date: 2011-08-30
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Publication No.: US08497540B2Publication Date: 2013-07-30
- Inventor: Chi-Di An , Chien-Hung Chen , Yu-Juan Chan
- Applicant: Chi-Di An , Chien-Hung Chen , Yu-Juan Chan
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Agent Steven E. Koffs
- Main IPC: H01L27/06
- IPC: H01L27/06

Abstract:
A device comprises a substrate having at least one active region, an insulating layer above the substrate, and an electrode in a gate electrode layer above the insulating layer, forming a metal-oxide-semiconductor (MOS) capacitor. A first contact layer is provided on the electrode, having an elongated first pattern extending in a first direction parallel to the electrode. A contact structure contacts the substrate. The contact structure has an elongated second pattern extending parallel to the first pattern. A dielectric material is provided between the first and second patterns, so that the first and second patterns and dielectric material form a side-wall capacitor connected in parallel to the MOS capacitor.
Public/Granted literature
- US20130049088A1 CAPACITOR AND METHOD OF FORMING SAME Public/Granted day:2013-02-28
Information query
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