Invention Grant
- Patent Title: Micro electrical mechanical system
- Patent Title (中): 微机电系统
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Application No.: US11870306Application Date: 2007-10-10
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Publication No.: US08497577B2Publication Date: 2013-07-30
- Inventor: Chien-Hua Chen , David M. Craig , Charles C. Haluzak
- Applicant: Chien-Hua Chen , David M. Craig , Charles C. Haluzak
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
An apparatus includes a Micro Electrical Mechanical System (MEMS) having electrical contacts and a MEMS device in electrical communication with the electrical contacts. A lid is oriented over the MEMS device and not the electrical contacts. The lid has a base region and a top region, the base region being wider in dimension than the top region and oriented in closer proximity to the MEMS device than the top region.
Public/Granted literature
- US20080029880A1 Micro Electrical Mechanical System Public/Granted day:2008-02-07
Information query
IPC分类:
