Invention Grant
US08497697B2 Apparatus and method for testing multiple integrated circuit devices on a film frame handler
有权
用于在胶片框处理器上测试多个集成电路装置的装置和方法
- Patent Title: Apparatus and method for testing multiple integrated circuit devices on a film frame handler
- Patent Title (中): 用于在胶片框处理器上测试多个集成电路装置的装置和方法
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Application No.: US12815174Application Date: 2010-06-14
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Publication No.: US08497697B2Publication Date: 2013-07-30
- Inventor: Gerard Blaney
- Applicant: Gerard Blaney
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: G01R31/26
- IPC: G01R31/26
Abstract:
Film frame assemblies and apparatus for testing and singulating integrated circuit packages, as well as associated methods for forming a film frame assembly, and testing and singulating integrated circuit packages are disclosed. A plurality of leads on a lead frame are cut to form singulated integrated circuit packages. Apparatus and methods are disclosed for mechanically aligning a set of electrical contacts attached to a contactor body with a plurality of leads on a singulated integrated circuit package.
Public/Granted literature
- US20110306166A1 APPARATUS AND METHOD FOR TESTING MULTIPLE INTEGRATED CIRCUIT DEVICES ON A FILM FRAME HANDLER Public/Granted day:2011-12-15
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