Invention Grant
- Patent Title: IC package with embedded phased array antenna
- Patent Title (中): IC封装带嵌入式相控阵天线
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Application No.: US13491310Application Date: 2012-06-07
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Publication No.: US08497805B2Publication Date: 2013-07-30
- Inventor: Ahmadreza Rofougaran , Maryam Rofougaran
- Applicant: Ahmadreza Rofougaran , Maryam Rofougaran
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Farjami & Farjami LLP
- Main IPC: H01Q1/38
- IPC: H01Q1/38

Abstract:
Aspects of a method and system for configurable antenna in an integrated circuit package are provided. In this regard, a phased array antenna embedded in a multi-layer integrated circuit (IC) package may be utilized for transmitting and/or receiving signals. An IC enabled to transmit and/or receive signals may be bonded to the multi-layer IC package and may communicate a reference signal and/or one or more phase shifted versions of said reference signal to the antenna. One or more phase shifters (fabricated, for example, in planar transmission line) may be embedded in the multi-layer IC package and may be controlled via an IC bonded to the multi-layer IC package. The phased array antenna may comprise a plurality of antenna elements which may each comprise an interconnection for communicatively coupling to an associated transmitter and/or receiver, a feeder line, a quarter wavelength transformer, and a radiating portion (e.g., a folded dipole).
Public/Granted literature
- US20120249394A1 IC Package with Embedded Phased Array Antenna Public/Granted day:2012-10-04
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