Invention Grant
US08497995B2 Measurement apparatus and method for measuring surface shape and roughness
有权
用于测量表面形状和粗糙度的测量装置和方法
- Patent Title: Measurement apparatus and method for measuring surface shape and roughness
- Patent Title (中): 用于测量表面形状和粗糙度的测量装置和方法
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Application No.: US12669825Application Date: 2008-08-14
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Publication No.: US08497995B2Publication Date: 2013-07-30
- Inventor: Kazuyuki Ota , Hiroshi Yoshikawa , Yusuke Mitarai , Masafumi Takimoto , Kazunori Okudomi , Hiroyuki Shinbata , Kenji Saitoh , Masakazu Matsugu
- Applicant: Kazuyuki Ota , Hiroshi Yoshikawa , Yusuke Mitarai , Masafumi Takimoto , Kazunori Okudomi , Hiroyuki Shinbata , Kenji Saitoh , Masakazu Matsugu
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2007-218382 20070824
- International Application: PCT/JP2008/064859 WO 20080814
- International Announcement: WO2009/028377 WO 20090305
- Main IPC: G01B11/24
- IPC: G01B11/24
Abstract:
A measurement apparatus includes an illumination light setting unit which sets illumination light having an optical characteristic corresponding to a microstructure which is formed on the surface of a measurement target and is to be measured, and a measurement unit which measures reflected light when the measurement target is irradiated with the illumination light. In addition, an extraction unit extracts, from the measured reflected light, information about the surface shape of the measurement target and the microstructure formed on the surface.
Public/Granted literature
- US20100220338A1 MEASUREMENT APPARATUS AND METHOD FOR MEASURING SURFACE SHAPE AND ROUGHNESS Public/Granted day:2010-09-02
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