Invention Grant
- Patent Title: Method of manufacturing array substrate, array substrate, method of manufacturing screen, and screen
- Patent Title (中): 阵列基板，阵列基板，屏幕制造方法和屏幕的制造方法
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Application No.: US13449688Application Date: 2012-04-18
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Publication No.: US08498050B2Publication Date: 2013-07-30
- Inventor: Atsushi Saito
- Applicant: Atsushi Saito
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: ALG Intellectual Property, LLC
- Priority: JP2011-099237 20110427
- Main IPC: G03B21/56
- IPC: G03B21/56
Abstract:
A plurality of convex portions, or concave portions which is transferred in an array shape, and a groove are transferred with respect to the substrate having thermoplasticity by a mold member having shapes of the convex portion, or the concave portion, and a protruding portion as the groove, and substrate transfer processing is included, in which the convex portion, or concave portion, and a protruding portion which are formed in the mold member are transferred to the substrate by pressing the mold member to the substrate.
Public/Granted literature
- US20120275020A1 METHOD OF MANUFACTURING ARRAY SUBSTRATE, ARRAY SUBSTRATE, METHOD OF MANUFACTURING SCREEN, AND SCREEN Public/Granted day:2012-11-01
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