An electrostatic chuck includes an electrostatic electrode embedded in a ceramic base having a wafer-supporting surface capable of holding a wafer, the electrostatic electrode being parallel to the wafer-supporting surface. The ceramic base is composed of a dense ceramic having a MgO content of 99% by weight or more. The electrostatic electrode is a disc-like electrode composed of, for example, at least one metal selected from the group consisting of Ni, Co, and Fe. The electrostatic electrode includes a conductive tablet connected to the center thereof. The tablet is exposed at the bottom of a counter-bored hole formed so as to reach the tablet from a back surface of the ceramic base, and is connected to a feeding terminal, composed of Ni, inserted into the counter-bored hole.