Invention Grant
- Patent Title: Heat sink for power circuits
- Patent Title (中): 电源电路散热片
-
Application No.: US12838089Application Date: 2010-07-16
-
Publication No.: US08498116B2Publication Date: 2013-07-30
- Inventor: Glenn T. Siracki
- Applicant: Glenn T. Siracki
- Applicant Address: US OH Mayfield Heights
- Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee Address: US OH Mayfield Heights
- Agency: Fletcher Yoder, P.C.
- Agent Alexander A. Kuszewski; John M. Miller
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
The present invention relates generally to a heat sink comprising a plurality of fins, each fin having two or more prongs extending from a root section of the fin. In certain embodiments, the heat sink may be assembled by aligning the plurality of fins within slots between protrusions extending from a base of the heat sink. However, in other embodiments, the plurality of fins may have connector ends having female sides and opposite male sides, wherein the plurality of fins may be attached to each other via the interlocking female and male sides, thereby forming at least part of the base of the heat sink, and fortified with reinforcing members.
Public/Granted literature
- US20120014067A1 HEAT SINK FOR POWER CIRCUITS Public/Granted day:2012-01-19
Information query