Invention Grant
- Patent Title: Data transport module
- Patent Title (中): 数据传输模块
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Application No.: US11131858Application Date: 2005-05-18
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Publication No.: US08498309B2Publication Date: 2013-07-30
- Inventor: Edoardo Campini , David Formisano , Marwan Khoury , Bradley T. Herrin
- Applicant: Edoardo Campini , David Formisano , Marwan Khoury , Bradley T. Herrin
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Robert A. Greenberg
- Main IPC: H04J3/16
- IPC: H04J3/16 ; H04J3/22 ; H05K7/16
Abstract:
A data transport module includes a connector to be received and coupled to a backplane within a modular platform. The data transport module also includes another connector to be received and coupled in a slot resident on a board such that the data transport module is coplanar to the board when received and coupled in the slot. The data transport module further includes one or more data transport interfaces to forward data between the board and the backplane via the connectors.
Public/Granted literature
- US20060262781A1 Data transport module Public/Granted day:2006-11-23
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