Invention Grant
- Patent Title: Method for identifying a wafer serial number
- Patent Title (中): 识别晶圆序列号的方法
-
Application No.: US12757044Application Date: 2010-04-09
-
Publication No.: US08498471B2Publication Date: 2013-07-30
- Inventor: Wei-Chin Chen , Chien-Ming Li
- Applicant: Wei-Chin Chen , Chien-Ming Li
- Applicant Address: TW Hwa-Ya Technology Park Kueishan, Taoyuan
- Assignee: Inotera Memories, Inc.
- Current Assignee: Inotera Memories, Inc.
- Current Assignee Address: TW Hwa-Ya Technology Park Kueishan, Taoyuan
- Agent Winston Hsu; Scott Margo
- Priority: TW98139764A 20091123
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A method of identifying a wafer serial number is provided. First, a wafer having a wafer serial number is provided. Second, an identification procedure is carried out to identify the wafer serial number by means of multiple identification recipes thereby obtaining multiple digit results which correspond to the multiple identification recipes and a specific digit in the wafer serial number. The multiple digit results include at least two of a successful result and an unsuccessful result. Then, the wafer serial number is determined in accordance with the multiple digit results.
Public/Granted literature
- US20110123136A1 METHOD FOR IDENTIFYING WAFER SERIAL NUMBER Public/Granted day:2011-05-26
Information query