Invention Grant
US08498471B2 Method for identifying a wafer serial number 有权
识别晶圆序列号的方法

  • Patent Title: Method for identifying a wafer serial number
  • Patent Title (中): 识别晶圆序列号的方法
  • Application No.: US12757044
    Application Date: 2010-04-09
  • Publication No.: US08498471B2
    Publication Date: 2013-07-30
  • Inventor: Wei-Chin ChenChien-Ming Li
  • Applicant: Wei-Chin ChenChien-Ming Li
  • Applicant Address: TW Hwa-Ya Technology Park Kueishan, Taoyuan
  • Assignee: Inotera Memories, Inc.
  • Current Assignee: Inotera Memories, Inc.
  • Current Assignee Address: TW Hwa-Ya Technology Park Kueishan, Taoyuan
  • Agent Winston Hsu; Scott Margo
  • Priority: TW98139764A 20091123
  • Main IPC: G06K9/00
  • IPC: G06K9/00
Method for identifying a wafer serial number
Abstract:
A method of identifying a wafer serial number is provided. First, a wafer having a wafer serial number is provided. Second, an identification procedure is carried out to identify the wafer serial number by means of multiple identification recipes thereby obtaining multiple digit results which correspond to the multiple identification recipes and a specific digit in the wafer serial number. The multiple digit results include at least two of a successful result and an unsuccessful result. Then, the wafer serial number is determined in accordance with the multiple digit results.
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