Invention Grant
- Patent Title: Mapped thermal electric cooling
- Patent Title (中): 映射热电冷却
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Application No.: US12764286Application Date: 2010-04-21
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Publication No.: US08498841B2Publication Date: 2013-07-30
- Inventor: Amip Shah , Chandrakant Patel
- Applicant: Amip Shah , Chandrakant Patel
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Methods and apparatus are provided for use with thermal electric cooling devices (TECDs). An apparatus is mapped so as to identify the heat dissipating entities and zones thereof. A first cooling plan is devised in accordance with the mapping, the cooling plan being dependant upon TECDs. At least one other cooling plan is devised that is distinct from the first cooling plan. The coefficient of performance (COP) for each of the cooling plans is calculated. One of the cooling plans is selected and implemented in accordance with a comparison of the COPs. Precision, zone-oriented cooling is provided, avoiding excessive material scale and wasted energy.
Public/Granted literature
- US20110264433A1 MAPPED THERMAL ELECTRIC COOLING Public/Granted day:2011-10-27
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